{"id":31886,"date":"2026-07-07T18:00:00","date_gmt":"2026-07-07T16:00:00","guid":{"rendered":"http:\/\/stocks-future.com\/?guid=a9ba608a13a4f9b4eae41c2be2fd130d"},"modified":"2026-07-07T18:00:00","modified_gmt":"2026-07-07T16:00:00","slug":"accm-introduces-celeritas-smc-a-production-ready-silicon-matched-core-for-advanced-packaging","status":"publish","type":"post","link":"https:\/\/stocks-future.com\/?p=31886","title":{"rendered":"ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging"},"content":{"rendered":"

\nShipping now from ACCM's Wisconsin facility, Celeritas SMC enables low-warpage, high-reliability chiplet and embedded-bridge packages using established substrate processes, without TGVs, brittle glass handling, or glass-specific capital equipment<\/i><\/p><\/a><\/a>

SAN JOSE, Calif. & LA CROSSE, Wis.--(BUSINESS WIRE)--Advanced Chip and Circuit Materials (ACCM) today introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines. Available now from ACCM's Wisconsin facility, the material is designed for large-body chiplet packages, embedded-bridge architectures, and other advanced packages in which conventional organic cores face growing warpage and thermomechanical reliability limits.<\/p>

\nCeleritas SMC provides the low CTE, stiffness, dimensional stability, and electrical performance that have driven industry interest in glass core, without requiring through-glass vias, glass-specific metallization, brittle-panel handling, or wholesale line retooling.<\/p>

\nWhy advanced packaging needs a new core<\/b><\/p>

\nAI and high-performance computing packages are growing faster than the materials beneath them. As package bodies exceed 100 mm per side and silicon bridge dies are embedded directly into the substrate, the thermal expansion mismatch between a conventional organic core at 12 to 16 ppm\/\u00b0C and silicon at roughly 3 ppm\/\u00b0C drives warpage, embedding stress, and interconnect fatigue that packaging engineers can no longer design around. The industry consensus is clear: the core must move toward the CTE of silicon.<\/p>

\nGlass core emerged as one route to that goal, and its target properties are real. Its commercialization, however, depends on glass-specific via formation, metallization, inspection, surface-preparation, and handling capabilities that are not broadly deployed in high-volume substrate manufacturing, together with substantial new capital investment across the supply chain. Celeritas SMC delivers the silicon-matched CTE, dimensional stability, and electrical performance sought from glass core through the manufacturing infrastructure the industry already operates.<\/p>

\nSilicon-matched performance without process reinvention<\/b><\/p>

\nCeleritas SMC matches silicon from room temperature to 100 \u00b0C and is tunable by construction, eliminating the bulk in-plane CTE mismatch between embedded silicon and the core. Vias are formed by standard mechanical and laser drilling. Build-up films bond directly using established lamination processes, without glass-specific surface preparation or adhesion-promotion steps. Panels handle, laminate, and singulate on the installed equipment base using the process fabricators already use.<\/p>

\nThe property set extends well beyond CTE: a glass transition temperature above 300 \u00b0C for compatibility with the full assembly and rework thermal budget, a high stiffness, a dissipation factor of 0.004 at 10 GHz with lower loss grades available for the most demanding signal integrity applications, moisture absorption of 0.1 percent at saturation, and core thicknesses from 100 to 1,200 \u00b5m and above, covering everything from thin coreless-adjacent constructions to thick high-rigidity platforms for the largest package bodies.<\/p>

\nCeleritas SMC at a glance<\/b><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n

\nProperty<\/b><\/p><\/td>

\nCeleritas SMC<\/b><\/p><\/td>

\nGlass Core (typical published values)<\/b><\/p><\/td>

\nConventional Organic Core (BT, ABF-clad)<\/b><\/p><\/td><\/tr>\n

\nCTE, X\/Y (25 \u00b0C to 100 \u00b0C)<\/b><\/p><\/td>

\nMatched to silicon; tunable by construction<\/p><\/td>

\n3 to 9 ppm\/\u00b0C depending on composition<\/p><\/td>

\n12 to 16 ppm\/\u00b0C<\/p><\/td><\/tr>\n

\nTg (Glass Transition Temperature)<\/b><\/p><\/td>

\nAbove 300 \u00b0C<\/p><\/td>

\nNot applicable (softening point)<\/p><\/td>

\nTypically 180 to 260 \u00b0C<\/p><\/td><\/tr>\n

\nDissipation factor, 10 GHz<\/b><\/p><\/td>

\n0.004; lower loss grades available<\/p><\/td>

\n0.002 to 0.006 depending on composition<\/p><\/td>

\n0.005 to 0.013<\/p><\/td><\/tr>\n

\nMoisture absorption<\/b><\/p><\/td>

\n0.1 percent at saturation<\/p><\/td>

\nNear zero (bulk); interfaces remain the reliability question<\/p><\/td>

\n0.2 to 0.8 percent<\/p><\/td><\/tr>\n

\nCore thickness range<\/b><\/p><\/td>

\n100 to 1,200 \u00b5m and above<\/p><\/td>

\nLimited by handling yield at thin gauges<\/p><\/td>

\nBroad<\/p><\/td><\/tr>\n

\nVia formation<\/b><\/p><\/td>

\nStandard mechanical and laser drilling on installed equipment<\/p><\/td>

\nThrough-glass vias: new toolsets for formation, metallization, and inspection<\/p><\/td>

\nStandard drilling<\/p><\/td><\/tr>\n

\nBuild-up film adhesion<\/b><\/p><\/td>

\nStrong, robust bond to industry standard build-up films<\/p><\/td>

\nRequires seed layers or surface treatments; unresolved at volume<\/p><\/td>

\nEstablished<\/p><\/td><\/tr>\n

\nHandling and singulation<\/b><\/p><\/td>

\nTough; standard panel handling, no fracture loss mode<\/p><\/td>

\nBrittle; chipping, cracking, and singulation yield loss<\/p><\/td>

\nEstablished<\/p><\/td><\/tr>\n

\nCapital required at the substrate maker<\/b><\/p><\/td>

\nNone; runs on the installed base<\/p><\/td>

\nMajor new investment across the line<\/p><\/td>

\nNone<\/p><\/td><\/tr>\n

\nCommercial status<\/b><\/p><\/td>

\nIn production, available for evaluation today<\/p><\/td>

\nRoadmap; pilot lines, not volume<\/p><\/td>

\nIn production<\/p><\/td><\/tr>\n

\nGlass core and conventional organic core values reflect typical published ranges and vary by composition and supplier.<\/i><\/p><\/td><\/tr>\n<\/table>

\nPerformance without the glass-core capital burden<\/b><\/p>

\n\u201cThe industry does not have a low CTE problem, it has a low CTE at acceptable cost problem,\u201d said Tarun Amla, PhD, Founder, President, and CEO of ACCM. \u201cGlass core asks the entire substrate supply chain to retool around through-glass vias before volume yields and economics have been established. Celeritas SMC gives packaging engineers silicon-matched CTE, high stiffness, and low loss on the equipment they already own, with the drilling, metallization, and lamination processes they already know. That is the difference between a roadmap concept and a material customers can put on their lines today.\u201d<\/p>

\nManaging stress across the complete package<\/b><\/p>

\nA low CTE package does not remove thermomechanical stress from the system; it relocates it. A package pulled down toward silicon CTE transfers the mismatch to the board-level interconnect, which becomes the new reliability bottleneck as package bodies grow and package-to-board integration tightens. ACCM is positioned on both sides of that interface: the same material platform behind Celeritas SMC enables printed circuit boards with tunable CTE from 2 to 10 ppm\/\u00b0C, allowing a graded CTE architecture from the die through the substrate to the system board. For embedded-bridge designs, CoWoS-L-class constructions, and other large-body chiplet packages, Celeritas SMC enables CTE management within the package substrate. For substrate-free architectures such as CoWoP, the broader ACCM material platform can provide tunable-CTE system-board materials, addressing the package-to-board interface where thermomechanical stress is otherwise concentrated.<\/p>

\nMade in America and available now<\/b><\/p>

\n\u201cEvery panel of Celeritas SMC is manufactured in Wisconsin, on a site that has made advanced laminates for American electronics for decades,\u201d said Keshav Amla, Founder and COO of ACCM. \u201cCustomers bring us a stackup, we supply material and applications-engineering support, and their fabricator processes it on equipment already installed in the line. Domestic production, direct applications engineering support, and an initial process-verification path measured in weeks give our customers both speed and supply-chain resilience as they plan their next-generation packages.\u201d<\/p>

\nCeleritas SMC is available for customer evaluation immediately, in core thicknesses from 100 to 1,200 \u00b5m and above. ACCM also offers ultra-low-loss build-up films engineered to pair with the core for customers seeking a complete low-loss, CTE-managed dielectric stack. A technical datasheet and application notes for embedded die and large-body substrate constructions are available under NDA.<\/p>

\nFor more details, you can read a companion FAQ on ACCM\u2019s website: ACCM Celeritas SMC FAQ<\/a> or reach out for more information, a meeting, or to start an evaluation or program through ACCM\u2019s contact page: ACCM Materials Inquiry<\/a><\/p>

\nAbout Advanced Chip and Circuit Materials, Inc. (ACCM)<\/b><\/p>

\nACCM is a US-based advanced materials company headquartered in San Jose, CA, manufacturing PCB, substrate, and build-up dielectric materials at its Wisconsin facility. The company develops materials solutions under the Celeritas brand for AI, ultra-high-speed digital, and semiconductor packaging applications, including ultra-low-loss laminates, CTE-engineered laminates, and cores for high-performance computing, networking, and advanced packaging. Celeritas HM50, Celeritas HM001, Celeritas SF1600, and Celeritas SMC are ACCM's flagship products for AI accelerator, ultra-high-speed, and advanced packaging applications.<\/p>

\nAll trademarks and product names are the property of their respective owners. References to third-party technologies are for identification purposes only and do not imply affiliation or endorsement.<\/i><\/p> Contacts<\/b>

\nTechnical and evaluation inquiries: Michael Gay, michael.gay@adv-ccm.com<\/a><\/p>","protected":false},"excerpt":{"rendered":"

Shipping now from ACCM’s Wisconsin facility, Celeritas SMC enables low-warpage, high-reliability chiplet and embedded-bridge packages using established substrate processes, without TGVs, brittle glass handling, or glass-specific capital equipmentSAN J…<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-31886","post","type-post","status-publish","format-standard","hentry","category-infos-businesswire"],"_links":{"self":[{"href":"https:\/\/stocks-future.com\/index.php?rest_route=\/wp\/v2\/posts\/31886","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/stocks-future.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/stocks-future.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/stocks-future.com\/index.php?rest_route=\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/stocks-future.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=31886"}],"version-history":[{"count":1,"href":"https:\/\/stocks-future.com\/index.php?rest_route=\/wp\/v2\/posts\/31886\/revisions"}],"predecessor-version":[{"id":31887,"href":"https:\/\/stocks-future.com\/index.php?rest_route=\/wp\/v2\/posts\/31886\/revisions\/31887"}],"wp:attachment":[{"href":"https:\/\/stocks-future.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=31886"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/stocks-future.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=31886"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/stocks-future.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=31886"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}